tech tip icon

Select Master Bond liquid, paste, film adhesives have been engineered to retain mechanical strength properties after prolonged exposure to humidity/elevated temperatures. These durable systems provide reliable solutions for critical bonding assemblies. Available in a range of viscosities, cure speeds, hardnesses, compounds over extended time periods will not degrade in operational use under extreme conditions. Used for joining metals including steel, aluminum, copper, brass, nickel, magnesium, ceramics, plastics, composites these products have demonstrated after proper cleaning and surfaces treatment that adhesive bonded interfaces offer superior structural performance/stability. This will ensure joint strength survival throughout equipment life cycle.

Simultaneous exposure to mechanical loads, elevated temperatures, weathering can lead to rapid aging of adhesive bonded structures. Accelerated degradation can also occur from exposure to water and cyclic loading, especially in confined areas. Interfacial failure from water will decrease load bearing capability of the bonded joints. Rigorous testing is necessary to reliably predict performance of bonded substrates under extreme conditions such as damp heat storage at 85°C/85% RH for 1,000 hours. Test results can be used by design engineers to ascertain long term stability and feasibility of use in manufactured equipment/devices.

It is important to note that heat curing or post heat curing epoxy adhesives will significantly improve their chemical/temperature resistance and strength properties. High cross-link density formation through thermal cures play an essential role in optimization of strength retention.