Prevent malfunctions of electronic devices with conductive coatings for EMI/RFI shielding applications developed by Master Bond. From epoxy adhesives and sealants to silicones and sodium silicates, we have a wide range of formulations to meet the ever changing needs of devices requiring EMI/RFI shielding.




Video Transcript

Protection from electromagnetic interference (EMI) and radio frequency interference (RFI) is essential to prevent malfunctions of electronic devices. Electromagnetic waves can be generated both internally and externally. Careful consideration by design engineers is needed to optimize the selection of the most cost effective solution. Shielding electronic circuits, modules and subsystems becomes more essential as the pace of development of devices increases rapidly. Also, the popularity of wireless devices has created additional challenges in avoiding interference of such devices and between other devices. Innovative Master Bond coatings for EMI/RFI shielding:


  • Graphite filled epoxy adhesive/sealant for use where a non-metallic filler is required
  • Superb resistance to moisture and chemicals
  • Exceptional durability

MasterSil 705C

  • Single component, non-corrosive silicone
  • Carbon filled
  • Electrically conductive
  • Tack free time 3-7 minutes at ambient temperatures
  • Serviceable up to 400°F


  • Aqueous based sodium silicate
  • One component, silver filled
  • Highly effective moisture barrier
  • Bonds well to a wide variety of substrates
  • Temperature resistance up to 700°F

MasterSil 705S

  • One part, non-corrosive silicone
  • Silver filled
  • Shore A hardness of 70
  • Extremely low volume resistivity

For more information on these coatings for EMI/RFI shielding contact our technical representatives.