With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound can be used while observing its flowability and ease of use.

Video Transcript

Master Bond EP4EN-80 is a one part fast curing epoxy for bonding and small encapsulation applications. This system is NASA low outgassing approved and can be cured at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes followed by 30 minutes at 80-85°C. When used as an adhesive, EP4EN-80 can be applied in thicknesses as thin as 10-15 microns. Its ultra low viscosity of 600-1,800 cps, and minimal shrinkage makes it suitable for small potting and encapsulations up to about a ¼ inch thick – protecting components from moisture, dirt and dust. Due to its ultra fine particle size filler material this system offers unique gap filling and heat transfer capabilities. EP4EN-80 maintains excellent thermal conductivity and electrical insulation properties upon curing, as well as a compressive strength of 24,000-26,000 psi and an ultra high tensile modulus of 1,200,000-1,400,000 psi at room temperature. For more information or to discuss your application contact us today.