See how to properly apply a staking compound to an electronic component for enhanced mechanical reinforcement. Learn how to apply the material on components of differing sizes and shapes as well as what material works best for this type of application.
The main use for adhesive staking is to provide extra mechanical support for electronic components and other parts that may be damaged due to vibration, shock or handling. Different components require different methods of staking. Here we have a DIP component which we will be staking at the four corners using a fine tip syringe with a high viscosity compound. In this live application you can see an example of how to apply the staking material. Our goal is to connect the corners of the component to the circuit board while ensuring that the material does not flow under the component. Capacitors often require staking for enhanced stability. In this case, the material is applied to the edge of the component while making mechanical connection with the circuit board. Here we see a live demonstration of how this application might be done. Note that there are other ways to stake a capacitor including staking at more than one location or even applying the material around the entire component. After applying the staking compound the material should be cured based on the instructions on the technical datasheet. In these demonstrations we used one part epoxy system EP17HTDA-1. This thermally conductive, electrically insulative material features a paste viscosity. It cures in one to two hours at 350˚F with minimal shrinkage. For more information contact us to discuss your application.