Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 passes NASA low outgassing tests and develops a high bonding strength.
When your application calls for a NASA low outgassing approved epoxy, Master Bond Polymer System EP21TCHT-1 has wide appeal. This two component heat resistant compound is thermally conductive and electrically insulative, making it ideal for use in electronic applications.
It is also extensively used in aerospace applications as it can be successfully utilized in high vacuum environments.
As a thixotropic paste, it is easy to apply and doesn’t run. It cures at room temperature and is serviceable from cryogenic temperatures of 4K to high temperatures of 400°F. It develops high bonding strength and retains this strength even upon exposure to high temperatures.
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