This video demonstrates the ease of use and impressive properties of Master Bond Supreme 18TC, a one component smooth epoxy paste adhesive. Formulated with a blend of special thermally conductive fillers, this system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m•K)]. It can be used in a variety of high tech industries, including aerospace, electronic, optical, cryogenic and specialty OEM.




Video Transcript

NASA low outgassing approved Supreme 18TC is a one component epoxy with very low thermal resistance and high thermal conductivity. Supreme 18TC can be applied in bond lines as thin as 10 to 15 microns which leads to lower thermal resistance and higher thermal conductivity. This outcome is based on the equation R=t/K where R=thermal resistance, t is thickness and K the thermal conductivity.

With its easy to handle, smooth paste consistency, Supreme 18TC can be conveniently applied with a spatula or knife. As a one part system, its working life at room temperature is practically unlimited. Supreme 18TC requires an elevated temperature cure. This structural adhesive offers low shrinkage upon curing, a low coefficient of thermal expansion and a high degree of dimensional stability. Supreme 18TC maintains its high performance properties over the wide service temperature range of 4K to 400°F.

This system is available in a variety of packaging options including an ounce, half pint, pint, quart and gallon cans. To find out more about Supreme 18TC and how it can be used in your application, give us a call.