Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill. This video demonstrates the process of dispensing the epoxy paste and creating a barrier, or “dam”, which can then be filled by a flowable encapsulant. This thermally conductive compound also meets NASA low outgassing specifications and can withstand 1,000 hours at 85°C/85% RH.




Video Transcript

Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. There are two methods to protect chips and their wire bonds. Glob topping is where the encapsulating system is dispensed and applied directly to the area to be protected. Dam-and-filling entails dispensing the damming material around the area to be encapsulated.

The dam-and-fill process begins by attaching the die to the circuit board and moves onto wire bonding. When that portion of the application is complete, Supreme 3HTND-2DM is readily dispensed from a syringe or automated dispensing system to create a structurally sound barrier. This material will cure in place and will not run, in essence forming a dam. Then a flowable encapsulant is applied to cover the remaining area to be protected.

This thermally conductive, electrically insulating compound meets NASA low outgassing specifications. Its inherent toughness allows it to withstand the most intense types of thermal cycling. The noteworthy characteristics of Supreme 3HTND-2DM also make it ideal for use in various bonding and sealing applications requiring a barrier to block flow. It is available for use in syringes, cartridges and jars.

For more information, contact us to discuss your application.