Master Bond Supreme 11AOHT-LO is a two component epoxy resin system for high performance bonding and sealing. Its most outstanding features include high thermal conductivity, excellent electrical insulation properties and temperature resistance up to 400°F.
Simon is a design engineer working for A to Z Aerospace. His current project involves developing a miniaturized electronic device that requires superior thermal management. That’s when he gave Master Bond a call.
A technical specialist was assigned to Simon’s case to provide one on one assistance. After analyzing his needs, a recommendation was made for Supreme 11AOHT-LO, a thermally conductive adhesive with excellent mechanical strength, toughness and durability. This NASA low outgassing approved system withstands temperatures up to 400°F, endures thermal cycling and resists stress cracking fatigue.
Supreme 11AOHT-LO was especially suited for Simon’s application because of its convenient one-to-one mix ratio and room-temperature cure schedule. It also gave him an option to mix manually or automatically.
After rigorous testing, A to Z Aerospace was very happy to report that the device was able to withstand more thermal cycles than with the alternative adhesive. To find out how we can help you meet your application requirements contact Master Bond today.