Advanced power and high frequency communications electronics have become more sophisticated. Fabricating and assembling these devices involves carefully selecting the proper adhesives, die attach compounds, glob-top encapsulants, underfills and potting compounds. Engineers must be familiar with how these systems can affect design so that they meet and exceed performance objectives. Learn more about how adhesives aid in thermal management, and how the different chemistries may be better suited for differing applications.

 

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