As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges in assembling die, package, and other components into products able to cope with increasing heat loads, adhesives are uniquely qualified to meet these increasingly diverse requirements. Learn why adhesives with ultra low thermal resistance are the preferred bonding method for electronic applications requiring superior thermal management.


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