EP41S-6 Product Information

Two part epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations..

EP72M4 Product Description

Two component, highly flexible epoxy system EP72M4

Two Component, Flexibilized Epoxy System for High Performance Bonding, Coating, Sealing and Encapsulation with Convenient One to One Mix Ratio, Features Superior Thermal Cycling Capabilities, Along with Resistance to Vibration, Impact and Thermal Shock.

EP41S-5LV Product Information

Low viscosity, chemically resistant epoxy system EP41S-5LV

Two component low viscosity epoxy system with superb chemical resistance especially to solvents, acids, bases, alcohols and fuels

EP88FL Product Information

Low viscosity, optically clear, two part epoxy adhesive

Two component, room temperature curing epoxy for bonding,coating, sealing and potting

EP37-3LV Product Information

EP37-3LV Two Part Epoxy System

Two Component, Very Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Filament Winding with Exceptionally Low Exotherm and Long Working Life.

EP30NS Product Information

EP30NS Two Part Epoxy

Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.

MasterSil 151TC Product Information

MasterSil 151TC Two Part Silicone

Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.

EP42HT-3AO Product Information

EP42HT-3AO Two Part Epoxy

Two Component, Thermally Conductive Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications.

EP30LTE-2 Product Information

EP30LTE-2 Two Part Epoxy

Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion, Excellent Dimensional Stability and Low Shrinkage Upon Cure.

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