One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
Two Component Epoxy with High Temperature Resistance For Prolonged 600°F Service With Outstanding Chemical Resistance
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic paste.
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.
One component epoxy featuring non drip consistency for bonding, sealing and specialty dam-and-fill encapsulation
Specialized, One Component, Heat Curing Epoxy Featuring High Tensile Strength for Testing Adhesion or Cohesive Strength of Flame-Sprayed Coatings as per ASTM Specification C633.
Two part epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations..
One Component, High Viscosity LED Curable System for High Performance Bonding, Sealing, Coating and Encapsulation, Cures Tack-Free Without Any Oxygen Inhibition. Meets USP Class VI Specifications; Also Passes ISO 10993-5 Cytotoxicity Test.