Two Component, Room Temperature Setting, Heat Resistant Epoxy System for Bonding, Sealing, Coating & Casting Specially Formulated for Indirect Food Applications.
Two Component Thermally Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting
UL94HB flame retardant, two component epoxy system. Ffor encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickess with a PLC of 0. Convenient processing, 1:1 mix ratio by weight.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.
Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation
Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures and Sterilization Resistance, Passes 10993-5 for Cytotoxicity
One component die attach epoxy system with exceptionally high glass transition temperature. Resists temperatures up to +600°F. Thermally conductive, electrically insulating, Paste consistency.
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +350°F Featuring High Peel and High Shear Strength
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +250°F Featuring High Peel and High Shear Strength