One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One component, heat cured epoxy system for bonding, sealing, dam-and-fill applications. Resists temperatures up to +600°F. Thermally conductive, electrically insulating.
Two component, epoxy polysulfide for bonding, sealing, coating and encapsulation features easy processing
Two component system is thermally conductive, electrically insulative, and well suited for large potting applications
Two component high performance epoxy offering good thermal conductivity, electrical isolation, and high temperature resistance
Two component, flowable epoxy system with an exceptionally long open time at ambient temperature
Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures Chemical and High Temperature Resistance
Two component thermally conductive epoxy system for underfill applications has low exotherm
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.