EP112FLAO-1 Product Information

EP112FLAO-1 Two Part Epoxy

Toughened, two component, heat curing epoxy for potting & encapsulation

EP113 Product Information

EP113 Two Component Epoxy

Two Component Nanosilica Reinforced Epoxy Resin System Featuring Outstanding Mechanical Properties, Excellent Electrical Insulation, Superior Abrasion Resistance & Hardness as well as Optical Clarity for Coating, Casting, Potting, Encapsulation & Sealing for Services from -100°F to 500°F!

EP125 Product Information

EP125 Two Component Epoxy

Two Component Toughened Epoxy Resin System for Prolonged Service above 500°F with Outstanding Chemical Resistance.

EP19HTFL Product Information

EP19HTFL One Part Epoxy

One Component, Flexibilized Epoxy Resin System For Durable High Performance Adhesive/Sealants, Impregnants and Liners, with Good Storage Stability

EP21FL Product Information

 EP21FL Two Part Epoxy

Low Viscosity, Toughened, Two Component Epoxy System for High Performance Bonding, Sealing and Encapsulation, Capable of Withstanding Rigorous Thermal Cycling; Very Low Exotherm and Exceptionally Long Working Life.

EP21FLV Product Description

EP21FLV Two Component Epoxy

Very Fast Curing Two Component Epoxy Adhesive For High Performance General Purpose Bonding , Sealing and Coating

EP21TDC Product Information

EP21TDC Two Component Epoxy

Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance

EP21TDC-2 Product Information

EP21TDC-2 Two Part Epoxy

Two Component Epoxy System with Outstanding Flexibility and Peel Strength for High Performance Bonding, Sealing, Coating and Encapsulation. Serviceable at Cryogenic Temperatures.

EP21TDC-2AN Product Information

EP21TDC-2AN Two Part Epoxy

Two Component, Flexibilized, Highly Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.

EP21TDC-2AO Product Information

EP21TDC-2AO Two Part Epoxy

Two Component, Highly Flexibilized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.

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