One Component, Thermal Shock and Heat Resistant, Flexibilized Epoxy System for Bonding, as well as for Potting and Encapsulations up to ¼ Inch Thick; Features Good Toughness and Fast Cures.
One Component Thermal Shock and Heat Resistant Flexibilized Epoxy System For High Performance Electrical Potting, Encapsulation and Bonding Superior for underfill applications
Two Component, Flexible, Low Viscosity Epoxy Compound With Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Featuring Excellent Adhesion To Engineering Plastics And Metals, Especially Polycarbonates And Acrylics
Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity
Two Component, Silver Coated Nickel Filled Epoxy for High Performance Bonding, Coating and Sealing Featuring Low Volume Resistivity, Good Strength, Superior Toughness, and Cost Effectiveness.