EP3FL Product Information

EP3FL One Part Epoxy Compound

One Component, Thermal Shock and Heat Resistant, Flexibilized Epoxy System for Bonding, as well as for Potting and Encapsulations up to ¼ Inch Thick; Features Good Toughness and Fast Cures.

EP3HTFL Product Information

EP3HTFL One Part Epoxy

One Component Thermal Shock and Heat Resistant Flexibilized Epoxy System For High Performance Electrical Potting, Encapsulation and Bonding Superior for underfill applications

EP51FL Product Information

EP51FL Two Component Epoxy

Two component room temperature curing epoxy system for bonding, sealing and coating

EP51FL-1 Product Information

EP51FL-1 Two Part Epoxy

Two Component, Epoxy Resin System for High Performance Bonding, Sealing and Coating, Featuring High Flexibility and Viscosity along with Fast Curing.

EP79FL Product Information

EP79FL Two Part Epoxy System

Two Component, Silver Coated Nickel Filled Epoxy for High Performance Bonding, Coating and Sealing Featuring Low Volume Resistivity, High Flexibility, Convenient Handling and Cost Effectiveness.

MasterSil 773 Product Information

MasterSil 773 One Part Silicone

Low Viscosity Silicone Conformal Coating Featuring Fast Tack-Free Cures, Excellent Protection of Electronic Circuitry in High Humidity Environments as well as Resistance to Shock and Vibration

MB297FL Product Description

One Part Cyanoacrylate MB297FL

One Component Rapid Curing Vibration And Shock Resistant Cyanoacrylate Compound

Supreme 10HTFL Product Information

Supreme 10HTFL One Component Epoxy

Flexibilized, One Component Epoxy Adhesive/Sealant Featuring Outstanding Shear and Peel Strength; Serviceable from 4°K to 350°F. Requires Minimum Cure Temperature of 250°F.

UV10FL-1 & UV10FLTK-1 Product Description

One Component UV Curable Polymer Systems For High Performance Casting and Bonding

UV15FL Product Information

UV15FL One Part UV Curable Epoxy

One Component, High Strength Flexible UV Curable Epoxy Resin Compound For High Performance Bonding, Coating and Sealing With Enhanced Thermal Stability and Exceptional low shrinkage upon Curing.