EP21TDCF-3NV Product Information

EP21TDCF-3 Two Part Epoxy

Two Component, Higher Viscosity Epoxy System for High Performance Bonding and Sealing Featuring Rapid Curing and High Shear and Peel Strengths along with Excellent Toughness.

EP30DP-NV Product Information

EP30DP Two Part Epoxy

Toughened, Two Component, Room Temperature Curing Epoxy System for Bonding, Coating, Sealing and Encapsulation Featuring Abrasion Resistance and Cryogenic Serviceability.

EP21TPLV-NV Product Information

Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing, Coating and Encapsulation, Offers Excellent Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils.

EP21TP-2NV Product Information

Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing, Coating and Encapsulation, Offers Excellent Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils.

EP21TPND-NV Product Information

EP21TPND-NV Two Component Epoxy Polysulfide

Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing and Coating Offers Exceptional Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils; Paste-Like Consistency.

EP88FL Product Information

Low viscosity, optically clear, two part epoxy adhesive

Two component, room temperature curing epoxy for bonding,coating, sealing and potting

MasterSil 151TC Product Information

MasterSil 151TC Two Part Silicone

Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.

MasterSil 170 Gel Product Information

MasterSil 170 Gel: Two part silicone encapsulant

Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System.

EP36FR Product Information

EP36FR One Component Epoxy

One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.

EP30DPSP Product Information

EP30DPSP Two Part Epoxy

Meets USP Class VI Specifications for Medical Applications Flexibilized, Two Component , Epoxy-Urethane Blend Used For Bonding, Coating, Sealing and Encapsulation, Featuring Superior Toughness, Repairability, Abrasion Resistance, and Cryogenic Serviceability

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