MasterSil 152 Product Information

MasterSil 152 Two Part Silicone System

Two component, condensation curing silicone for potting, encapsulation and sealing

EP21TDC-4ND Product Information

EP21TDC-4ND Two Part Epoxy

Two component, highly flexibilized epoxy for bonding, sealing and coating

EP38CL Product Information

EP38CL Two Component Epoxy System

Two component high performance epoxy for bonding, sealing, coating and encapsulation

Super Gel 9AO Product Information

Super Gel 9AO Two Part Urethane Modified Epoxy

Two Component, Thermally Conductive Urethane Modified Epoxy Gel-Like System

MasterSil 151AN Product Information

MasterSil 151AN Two Part Silicone Compound

Two Component, Low Viscosity, Silicone Compound for High Performance Casting, Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Outstanding Flexibility and Unsurpassed Thermal Conductivity.

Super Gel 9AOND Product Information

Super Gel 9AOND Two Part Urethane Modified Epoxy System

Two component, thermally conductive urethane modified epoxy gel-like system

EP21LP Gray Product Information

EP21LP Gray Two Component Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.

EP21LP Black Product Description

EP21LP Black Two Part Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.

MasterSil 156 Product Information

MasterSil 156 Two Component Silicone

Two part silicone for high performance potting, encapsulation and sealing

EP101HTX-3 Product Information

EP101HTX-3 One Part Epoxy System

One Component, No Mix, Very Low Viscosity System Featuring Outstanding Electrical Insulation Properties and Excellent Thermal Shock Resistance for Bonding, Sealing, Coating, Encapsulation and Impregnation Applications.

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