Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermal Conductivity, Excellent Electrical Insulation Properties and Exceptionally Long Working Life.
One Component Epoxy System for Bonding, Sealing, Coating and Casting. Notable Retention of Properties at High Temperatures, Serviceable Up to 600°F. Qualifies to NASA ASTM E595 for low outgassing.
Two Component, Low Viscosity, Optically Clear Epoxy Featuring Outstanding Temperature and Chemical Resistance for Service up to 450°F. Requires Heat Curing at 250-300°F. Meets NASA low outgassing specifications.
Two Component, Low Viscosity, Silicone Compound for High Performance Casting, Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Outstanding Flexibility and Unsurpassed Thermal Conductivity.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Encapsulation Featuring Very Low Exotherm and a Long Working Life.
One Component, No Mix, Very Low Viscosity System Featuring Outstanding Electrical Insulation Properties and Excellent Thermal Shock Resistance for Bonding, Sealing, Coating, Encapsulation and Impregnation Applications.
Two Component Epoxy Resin System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures at Moderately Elevated Temperatures and Chemical and High Temperature Resistance. Passes NASA Low Outgassing Tests.
Room Temperature Curing, Urethane Modified Epoxy Gel-Like System for Sealing and Encapsulation Cures To a Low Shore A Hardness Ideal for Retrievability
