Two Component, Room Temperature Curing Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulation Featuring High Temperature Resistance, Good Dimensional Stability and Excellent Chemical Resistance.
One Component, High Viscosity LED Curable System for High Performance Bonding, Sealing, Coating and Encapsulation, Cures Tack-Free Without Any Oxygen Inhibition. Meets USP Class VI Specifications; Also Passes ISO 10993-5 Cytotoxicity Test.
Two Component, Lower Viscosity, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation with Outstanding Physical Properties and Easy Processing. Qualified to NASA Low Outgassing Specifications.
Two Component, Room Temperature Curing, Low Viscosity Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offering Superior Chemical Resistance and Excellent Physical Strength Properties.
One Component, Moderate Viscosity LED Curable System Cures Readily and Tack-Free at 405 nm Wavelength up to 1/8 Inch Thick Without Any Oxygen Inhibition.
One Component, High Viscosity LED Curable System for High Performance Bonding, Sealing, Coating and Encapsulation, Cures Completely at 405 nm Wavelength up to 1/8 Inch Thick; Cures Tack-Free Without Any Oxygen Inhibition; Excellent Physical Properties.
Two Component, Low Viscosity Epoxy System for Bonding, Sealing, Coating and Encapsulation with Excellent Physical and Electrical Insulation Properties. Featuring Superb Optical Clarity and Light Transmission.
Two Component, Low Viscosity Heat Curing Epoxy Resin System High PerformanceThermal Conductive & Electrical Insulation For Potting & Encapsulation Applications
