MB600 Product Information

MB600 Sodium Silicate System

One Part Sodium Silicate, Aqueous Based Adhesive and Coating System Featuring High Temperature Resistance Up To 1,500°F and Strong, Rigid Bonds.

Steelmaster 43HT Product Information

SteelMaster 43HT Two Part Epoxy

Two Component, Room Temperature Curing, Stainless Steel Filled Epoxy Resin System for Repair, Rebuilding, Restoring and Resealing of Worn or Damaged Metallic Components and High Compressive Strength Bonding of Carbide to Steel

Supreme 10ANHT Product Description

Supreme 10ANHT One Part Epoxy

One Component, Heat Curing Epoxy Adhesive Featuring both High Shear and High Peel Strength for Optimal Bonding Performance & Exceptionally High Thermal Conductivity

Supreme 10AOHT Product Information

Supreme 10AOHT One Part Epoxy System

One Component, Thermally Conductive, Electrically Insulating Epoxy Featuring Excellent Bonding and Physical Strength Properties, Along with a Superior Ability to Withstand Thermal Cycling. Cryogenically Serviceable. Requires Oven Curing.

Supreme 10HT Product Information

Supreme 10HT One Part Epoxy

One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Meets NASA Low Outgassing Specifications.

Supreme 10HTCL Product Information

Supreme 10HTCL Single Component Epoxy

One Component, Toughened Epoxy Adhesive/Sealant Offers Highly Desirable Combination of Properties Including High Peel and Shear Strengths, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Features Good Flow Properties. NASA low outgassing approved.

Supreme 10HTFL Product Information

Supreme 10HTFL One Component Epoxy

Flexibilized, One Component Epoxy Adhesive/Sealant Featuring Outstanding Shear and Peel Strength; Serviceable from 4°K to 350°F. Requires Minimum Cure Temperature of 250°F.

Supreme 11ANHT Product Information

Supreme 11ANHT Two Component Epoxy System

Two Component, Room Temperature Curing, High Temperature Resistant Epoxy For Bonding & Sealing Featuring Outstanding Thermal Conductivity & Electrical Insulation Properties

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