High Temperature Resistant

Two Component Heat Resistant Epoxy System for High Performance Structural Bonding and Sealing, Featuring a Glass Transition Temperature in Excess of 235°C.

Two Component, Thermally Conductive, Electrically Insulating Epoxy for High Performance Bonding, Sealing and Encapsulation. Features a Glass Transition Temperature in Excess of 200°C; Requires Elevated Temperature Curing at 250°F or Above. Meets NASA Low Outgassing.

Two Component, Room Temperature Curing Epoxy Adhesive Featuring Superior and Cost Effective Bonding Performance with Exceptionally Fast Cures for Service from 4K to 400°F.

Two Component Epoxy Resin System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures at Moderately Elevated Temperatures and Chemical and High Temperature Resistance.

Meets USP Class VI Requirements.