Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications.
Featuring a high glass transition temperature of 200-210°C, it resists temperatures up to 550°F.
This system exhibits an element of toughness, and is not as stiff as conventional epoxies that withstand extreme temperatures.
Master Bond Supreme 112 is a new two part epoxy for bonding, sealing, potting, and impregnation applications.
It is a heat curable system with a very low viscosity of 50-200 cps and a long open time of 2-3 days at room temperature for a 100 gram batch.
Supreme 112 features a high glass transition temperature of 190-195°C and is serviceable up to 288°C (550°F).
Master Bond UV10TK40M is a one part UV curable system, which is not oxygen inhibited, and can be used for bonding, sealing and coating applications.
UV10TK40M is optically clear, with a refractive index of 1.55. It has a high glass transition temperature (Tg) of 135-140°C and is serviceable from -60°F to +450°F.
Its hardness upon curing is 75-85 Shore D.
Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system.
It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids.
It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863.
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy
initially designed for glob top and chip coating applications.
However, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 cures within 2-3 hours at 175-185°F [80-85°C],
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation.
It is easy to use, with a mixing ratio of one to one by weight or volume.