Expanded Product List
Master Bond Product Search
541 products match
 |
EP30NS Moderate viscosity Nanosilica epoxy resin system. High strength rigid bonds. Lower linear shrinkage after cure. Serviceable from -60°F to +300°F. Cures readily at room temperature. Passes ASTM E595 for NASA low outgassing. |
 |
EP30P Two part, room temperature curing epoxy system with excellent optical transparency. Low viscosity. Bonds extremely well to more sensitive plastics such as polycarbonates and acrylics. Superior electrical insulation properties. Good chemical resistance to oils, fuels, water, hydraulic fluids. Serviceable from -60°F to +250°F. |
 |
EP30QF Quartz filled epoxy system. Features high tensile modulus, outstanding compressive strength and superior dimensional stability. Good flow properties. Suitable for potting/encapsulation. Reliable electrical insulator. Low CTE. Service temperature range from -60°F to +250°F. Excellent chemical resistance. Meets NASA low outgassing specifications. Withstands 1,000 hours at 85°C/85% RH. |
 |
EP30TC Thermally conductive epoxy. Can be applied in sections as thin as 5-10 microns. Excellent flow properties. Service temperature range -100°F to +300°F. High compressive strength. Outstanding electrical insulation characteristics. Passes NASA low outgassing tests. Low CTE. |
 |
EP31 Ultra high strength, two part epoxy adhesive that bonds well to most metals and plastics. Aluminum to aluminum lap shear strength exceeds 4,000 psi. T-peel strength >50 pli. Ambient temperature curing. Tough and resilient bonds. Combines low viscosity and optical clarity. Serviceable from -60°F to +250°F. Chemical resistant. First class electrical insulator. |
 |
EP31ND Non-drip structural epoxy adhesive. Paste consistency. Gap filling. Unmatched peel and shear strength. Tough and resilient. Protects against exposure to water, oil, fuels. Cures at room temperature. Service temperature range from -60°F to +250°F. |
 |
EP31T Epoxy adhesive has extraordinary shear and peel strength. Superb electrical insulator. Excellent chemical resistance. Optically clear. Service temperature range -60°F to +250°F. Low shrinkage upon cure. Room temperature curing. |
 |
EP33 Meets MIL-STD-883J Section 3.5.2 for thermal stability. Room temperature curing system. One one mix ratio by volume. Superb chemical resistance and dimensional stability. Shore D hardness 85-90. Suitable for bonding, sealing, coating. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +450°F. Easily machinable. |
 |
EP33CLV Room temperature curing epoxy adhesive features high thermal stability. Excellent chemical resistance properties. High bond strength. Volume resistivity o >1014 ohm-cm. Withstands thermal cycling. Serviceable from -60°F to +450°F. Successfully tested for 1,000 hours 85°C/85% RH. One to one mix ratio by volume. Low viscosity. |
 |
EP33LV Convenient one to one mix ratio by volume. Service temperature range -60°F to +450°F. Cures at room temperature. Moderate viscosity. Outstanding dimensional stability. Reliable electrical insulator. Robust chemical resistance. |