Expanded Product List
Master Bond Product Search
178 products match
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EP5TC-80 One component flowable paste epoxy for bonding, sealing and small encapsulation applications. High thermal conductivity and electrical insulation properties. Ultra fine particles filler material that allows application in very thin sections. Low exotherm and great dimensional stability. Serviceable from -50°C to +150°C. |
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EP62-1AO Cures rapidly at moderate elevated temperatures. Superior resistance to moisture. Two part epoxy has long pot life at ambient temperatures. High bond strength properties. Reliable electrical insulator. Serviceable from -60°F to +450°F. Withstands aggressive chemical exposure. Tg 160-165°C. Shore D hardnes >80. |
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EP75-1 Non-magnetic graphite conductive epoxy system. Useful lubricity. Exceptional dimensional stability. High bond strength properties. Superior durability. Volume resistivity 50-100 ohm-cm. Used in EMI/RFI shielding and static dissipation applications. Cost effective. Serviceable from -60°F to +250°F. |
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EP76M Nickel filled electrically conductive epoxy adhesive. Volume resistivity 5-10 ohm-cm. Cures at ambient temperatures. Convenient one to one mix ratio weight or volume. Serviceable from -60°F to +250°F. High compressive strength. Low shrinkage. Useful for applications requiring shielding and static dissipation. |
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EP76M-F Fast setting nickel filled electrically conductive epoxy adhesive. Room temperature curing. Volume resistivity 5-10 ohm-cm. Serviceable from -60°F to +250°F. Convenient one to one mix ratio weight or volume. Paste consistency. Good resistance to chemicals. High bond strength. |
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EP76MHT Two component nickel filled electrically conductive epoxy adhesive. Volume resistivity of 5-10 ohm-cm. Serviceable from -60°F to +400°F. Forgiving one to one mix ratio by weight or volume. High bond strength. Thermal conductivity. Paste like consistency. Superb dimensional stability. Applications include EMI/RFI shielding and static dissipation. |
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EP77M-1 Silver filled electrically conductive epoxy adhesive. Smooth paste viscosity. Volume resistivit <10-3 ohm-cm. Good rigidity. Formulated to cure at room temperature. Serviceable from -60°F to +300°F. Superb thermal conductivity. Dimensional stability. Available in premixed and frozen syringes. |
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EP77M-F Rapid room temperature curing silver filled electrically conductive adhesive. One to one mix ratio by weight or volume. Fixture time within 5-7 minutes even in small volumes. Exceptional low volume resistivity. Low outgassing. Superior bond strength to similar/dissimilar substrates/ Serviceable from -60°F to +250°F. |
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EP77M-FMed Rapid room temperature curing silver filled electrically conductive adhesive. One to one mix ratio by weight or volume. Fixture time within 5-7 minutes even in small volumes. Exceptional low volume resistivity. Low outgassing. Superior bond strength to similar/dissimilar substrates. Serviceable from -60°F to +250°F. |
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EP79 Cost effective alternative to silver filled epoxy with a silver coated nickel filler. Excellent conductivity and physical properties. Superior durability and thermal cycling capabilities. Cures readily at room temperature. Convenient one to one mix ratio weight or volume. Superb heat dissipation. Low linear shrinkage upon cure. Withstands 1,000 hours 85°C/85% RH. Serviceable from 4k to +275°F. Available in premixed and frozen syringes. |