Expanded Product List
Master Bond Product Search
609 products match
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Supreme 11AN Epoxy adhesive features outstanding thermal conductivity. Superb electrical insulation properties. Tough bonds. High shear and peel strength. Cures at ambient temperatures. Low CTE. Paste viscosity. Serviceable from -100°F to +250°F. |
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Supreme 11ANHT High temperature resistant epoxy for bonding and sealing. Toughened formulation. Superior shear/peel strength. Excellent heat transfer properties. Superb dielectric characteristics, Serviceable from -112°F to +400°F. |
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Supreme 11ANHT-2 High temperature resistant epoxy for bonding, coating and sealing. Toughened formulation. Withstands thermal cycling. Excellent heat transfer properties. Small particle size allows for thin bond lines and low thermal resistance. Serviceable from -112°F to +400°F. |
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Supreme 11AO Thermally conductive/electrically isolating epoxy adhesive/sealant. Ambient temperature curing. Convenient one to one mix ratio by weight or volume. Thick paste. High peel and shear strength. Toughened system. Well suited for bonding dissimilar substrates. Service temperature range -100°F to +250°F. |
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Supreme 11AOHT Thermally conductive, electrically insulative epoxy adhesive. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High peel and shear strength properties. Non-drip system. Resists -112°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight or volume. Cures at room temperature. |
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Supreme 11AOHT-LO Passes NASA low outgassing tests. Thixotropic paste viscosity. Convenient one to one mix ratio by weight or volume. High thermal conductivity. Excellent electrical insulation properties. Dimensionally stable. Withstands 1,000 hours 85°C/85% RH. Toughened system. Ability to resist rigorous thermal cycling. Service temperature range -112°F to +400°F. |
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Supreme 11AOHTLP Thermally conductive, electrically insulative epoxy adhesive. High peel and shear strength properties. Non-drip system. Resists -100°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight or volume. Cures at room temperature. Long working life. |
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Supreme 11AOHTMed Thermally conductive, electrically insulative epoxy adhesive. Meets ISO10993-5 for cytotoxicity. High lap shear strength properties. Non-drip system. Resists -112°F to +400°F. Toughened system. Can withstand rigorous thermal cycling. Convenient one to one mix ratio by weight. Versatile cure schedules. |
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Supreme 11HT High peel and shear strength system. Convenient one to one mix ratio. Serviceable from -100°F to +400°F. Superior resistance to impact, thermal shock, vibration and stress fatigue cracking. Excellent toughness. Cures readily at room temperature. User friendly. Dependable dimensional stability. Readily machinable. |
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Supreme 11HT-3A Service temperature from -100°F to +400°F. High bond strength to similar and dissimilar substrates. Excellent durability, toughness, impact resistance. Convenient 100 to 50 mix ratio by weight. Withstands prolonged exposure to water, oils, fuels and most organic solvents. Aramid fiber reinforcements assures outstanding dimensional stability. |