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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21TDCF-3NV Two component, higher viscosity epoxy system for bonding and sealing Tensile Lap Shear Strength >2000 psi Tensile Modulus 250,000-300,000 psi	RoHS Compliant	Bonding	Part A: paste, Part B: paste	75°F: 1-2 days; 200°F: 1-2 hours	50-55 Shore D	-100°F to +250°F	/tds/ep21tdcf-3nv
EP21TDCHT Versatile, toughened two component epoxy for bonding, sealing and coating Tensile Lap Shear Strength >2,700 psi Tensile Modulus 200,000-250,000 psi	RoHS Compliant MIL-STD-883J for Thermal Stability	Bonding Sealing Coating Gap Filling	Part A: 60,000-110,000 CPS, Part B: 70,000-140,000 CPS	overnight at 75°F, followed by 1-2 hours at 150-200°F	>60 Shore D	-112°F to +350°F	/tds/ep21tdcht
EP21TDCHT-LO Versatile, toughened two component epoxy for bonding, sealing and coating Tensile Lap Shear Strength 2,600-2,800 psi Tensile Modulus 200,000-250,000 psi	1,000 Hours at 85°C/85% RH NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling Encapsulation	Part A: 60,000-110,000 cps, Part B: 70,000-140,000 cps	overnight at 75°F, followed by 2-3 hours at 200°F, although a straight heat cure at 150-200°F for 2-3 hours is also acceptable	65-75 Shore D	-100°F to +350°F	/tds/ep21tdcht-lo
EP21TDCN Durable, two component epoxy for high performance bonding and sealing Tensile Lap Shear Strength 1,400-1,600 psi Volume Resistivity 5-10 ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	cures readily at 75°F in 3-4 days, or, alternatively, at 150-200°F for 2-3 hours	80-90 Shore D	-100°F to +275°F	/tds/ep21tdcn
EP21TDCN-LO Durable, two component epoxy for high performance bonding and sealing Tensile Lap Shear Strength 1,400-1,600 psi Volume Resistivity 5-10 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	Cures readily at 75°F in 3-4 days, or, alternatively, at 150-200°F for 2-3 hours. The optimum cure is overnight at 75°F, followed by 2-3 hours at 150-200°F.	80-90 Shore D	-100°F to +275°F	/tds/ep21tdcn-lo
EP21TDCNFL Two component, nickel conductive epoxy for high performance bonding and sealing Tensile Lap Shear Strength 600-700 psi Volume Resistivity 5-10 ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	cures at 75°F in 48-72 hours, or more rapidly at elevated temperatures (3-4 hours at 150-175°F)	45-55 Shore D	-100°F to 250°F	/tds/ep21tdcnfl
EP21TDCS Two component silver conductive epoxy for high performance bonding, coating and sealing; withstands 1,000 hours at 85°C/85% RH T-peel Strength 5-10 pli Volume Resistivity less than 10⁻³ ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Coating Sealing Gap Filling	paste	overnight followed by a post cure of 1-2 hours at 150-200°F	40-50 Shore D	4K to +275°F	/tds/ep21tdcs
EP21TDCS-LO Durable, high strength two component epoxy for bonding and sealing Tensile Lap Shear Strength 600-800 psi Volume Resistivity 0.001 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	Optimum cure schedule: Overnight at 75°F followed by 2-3 hours at 135-165°F.	40-50 Shore D	4K to +275°F	/tds/ep21tdcs-lo
EP21TDCSFL Two component, silver conductive epoxy for high performance bonding, coating and sealing T-peel Strength 10-15 pli Volume Resistivity <0.001 ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 40,000-60,000 cps, Part B: 50,000-70,000 cps	Optimum cure being overnight at ambient temperature followed by a heat cure at 150-200°F for 2-3 hours.	30-40 Shore D	4K to +275°F	/tds/ep21tdcsfl
EP21TDCSMed Silver conductive, two component epoxy for medical applications Tensile Lap Shear Strength 800-1,000 psi Volume Resistivity less than 0.001 ohm-cm	RoHS Compliant USP Class VI Medical ISO 10993-5 for Cytotoxicity	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F followed by 2-3 hours at 150-200°F	50-60 Shore D	4K to +250°F	/tds/ep21tdcsmed

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