Premier die attach epoxy EP3HTSDA-1 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies.
Master Bond’s video library presents engineers with an extensive variety of videos that cover topics ranging from packaging to product highlights, from "how-to" demonstrations to best practices for using epoxies, and more. Browse through our library for a look at what Master Bond has to offer.
EP39MAOHT blends a low viscosity and low exotherm, making it particularly well suited for large volume potting and castings. This video demonstrates this system’s mixing and flow properties.
Specifically designed for avionic/aviation applications, Master Bond EP93FRHT readily passes the stringent Airbus specifications for vertical burn test, smoke emission and toxic gas emission as listed under ABD 0031, Issue F.
Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill.
The selection process of an adhesive, coating or potting compound can pose a few challenges for engineers. Some of these include adhesion, temperature and thermal cycling resistance, and handling and curing time.
Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding, sealing and coating applications in the aerospace, optical and electronic industries.