Get an up close look at how the dam and fill process works to protect electronic components on a circuit board. This two step method utilizes a damming compound such as Supreme 3HTND-2DM-1 to create a barrier around the component, while the flowable filler material, EP3UF-1, covers the component for protection.
Toughened epoxy system for bonding, sealing and specialty dam-and-fill encapsulation. Requires no mixing. Rapid heat curing. Passes NASA low outgassing testing. Transfers heat efficiently. Stellar electrical insulation properties. Serviceable from -100°F to +400°F.
One component epoxy for bonding and underfill applications. Thermally conductive/electrically insulative. Meets NASA low outgassing specifications. High mechanical strength properties. Ultra fine particle sizes lowers thermal resistance. Convenient processing at moderate temperatures. Serviceable from -60°F to +250°F.