Selecting an adhesive for a medical device application can be challenging. Learn how to navigate the selection process while keeping in mind service conditions, desired properties and processing constraints. Find out more about two of the most important industry standards for adhesives used in medical devices, which are USP Class VI for biocompatibility and ISO 10993-5 for cytotoxicity. We will also discuss how different types of sterilization techniques, such as autoclaving, ethylene oxide, gamma radiation, and other methods, factor into choosing a suitable adhesive. We will delve into some real life, published case studies where bonding, sealing, coating, and encapsulating compounds have been successfully utilized in various medical device applications, and conclude the webinar with a live question and answer session.
Products Featured in the Webinar
Biocompatible two component epoxy adhesive, sealant, coating, encapsulant. Passes USP Class VI testing. Thermal cycling resistant. Can withstand exposure to EtO, radiation, chemical sterilants. Low viscosity. Easy to apply. Serviceable from -65°F to +250°F.
Medical grade, USP Class VI approved silicone. Addition type cure system. Optically clear. Low outgassing. Offers ambient or elevated temperature cures. Excellent for potting and encapsulation applications. Low shrinkage upon cure. Resists gamma radiation, EtO and various chemical sterilants. Serviceable from -65°F to +400°F.
Low viscosity, two part epoxy with outstanding chemical resistance. Passes USP Class VI biocompatibility tests. Capable of withstanding repeated sterilization cycles including radiation, EtO, chemical sterilants, autoclaving. Serviceable from -60°F to +450°F. Cures at room or elevated temperatures. Available in amber-clear and black colors. Castable in thicknesses up to 2-3 inches.
Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Thixotropic paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F.
Biocompatible two component epoxy. USP Class VI approved. Low viscosity. Versatile cure schedules. Resists EtO, gamma radiation and cold sterilants. High strength rigid bonds. Serviceable from -60°F to +250°F. Can be used for indirect food contact per 175.105 FDA specification.
Single component silicone with a paste viscosity for bonding, sealing and coating medical devices. Non-corrosive, neutral cure compound complies with USP Class VI and ISO 10993-5 specifications. Resists many kinds of sterilization including gamma and other types of radiation, EtO and some types of liquid sterilants.