Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
One Component, Thermally Conductive, Electrically Isolating, Room Temperature Curing, Non-Corrosive Silicone for High Performance Bonding, Sealing & Coating
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing Featuring Fast-Curing and Low Viscosity. Ideal for Smaller Encapsulations and Conformal Coatings.
Low Viscosity Silicone Conformal Coating Featuring Fast Tack-Free Cures, Excellent Protection of Electronic Circuitry in High Humidity Environments as well as Resistance to Shock and Vibration
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Flowable, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures.
