EP30-4Med Product Information

EP30-4Med Two Component Epoxy

Optically Clear, Two Component Epoxy Adhesive for High Performance Bonding, Coating, Sealing and Casting Featuring Superior Non-Yellowing Properties, Low Viscosity and Rapid Curing for Medical Device Assembly.

EP77M-FMed Product Information

EP77M-FMed Two Part Epoxy

Two Component, Silver Conductive Epoxy Adhesive for High Performance Bonding Featuring Rapid Set Up Time, Superior Bond Strength and Exceptionally Low Volume Resistivity Meets ISO 10993-5 for Cytotoxicity.

UV15DC80-10FHC Product Information

UV15DC80-10FHC Dual Cure Epoxy

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

EP29LPAOHT Product Information

EP29LPAOHT Two Part Epoxy

Two component system is thermally conductive, electrically insulative, and well suited for large potting applications

EP29LPTCHT Product Information

Two Part Epoxy EP29LPTCHT

Two component thermally conductive epoxy system for underfill applications has low exotherm

UV15DC80-FHC Product Information

UV15DC80-FHC

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV15DC80-10 Product Information

One Part UV and Heat Curable Compound

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV15DC80TK Product Information

UV15DC80TK One Part UV and Heat Curable Epoxy

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

UV22DC80ND Product Information

Nanosilica Filled, UV Dual Cure System

One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic paste.

UV22DC80TK Product Information

UV22DC80TK One Part, Dual UV and Heat Curing System

One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.

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