One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic paste.
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.
One Component, Higher Viscosity UV Curable System for High Performance Bonding, Sealing and Coating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg
One Component, Silver Conductive Epoxy Adhesive Featuring High Shear and High Peel Strengths. Uniquely Special System Cures between 175°F and 185°F with Physical Strength Properties and Excellent Conductivity.
