One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.
One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Biocompatible. Pass USP Class VI and ISO cytotoxicity testing. Non-corrosive, neutral type curing system. Good sterilization resistance properties. Withstand rigorous thermal cycling. Elongation 250-350%. Volume resistivit >1015 ohm-cm. Tensile strength 700-1100psi.
One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.
Two Component Epoxy Resin System for Durable, High Performance,
High Strength Coatings, Liners and Sealants Featuring Chemical Resistance and Fast Cure.