EP42HT-2FG Black Product Information

EP42HT-2FG Black Two Part Epoxy

Two Component, Room Temperature Setting, Heat Resistant Epoxy System for Bonding, Sealing, Coating & Casting Specially Formulated for Indirect Food Applications.

EP35AOLV Product Information

Two Component Thermally Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting

EP21QF Product Description

EP21QF Two Component Epoxy

Two component epoxy adhesive, sealant, coating, and encapsulating system. Robust physical strength profile, good flow properties.

EP21AC Product Information

EP21AC Epoxy Potting Compound

UL94HB flame retardant, two component epoxy system. For encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickess with a PLC of 0. Convenient processing, 1:1 mix ratio by weight.

EP5TC-80 Product Description

EP5TC-80 One Component Paste Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..

UV15DC80-1 Product Information

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

EP4G-80Med Product Description

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.

MasterSil 323 Product Information

Two Component, Addition Cured Silicone for bonding, sealing, and encapsulating. Featuring optical clarity and excellent strength properties.

EP41S-5Med Product Information

Two Part Epoxy EP41S-5Med

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.

EP4CL-80Med Product Description

One Part Epoxy EP4CL-80Med

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. Meets ISO 10993-5

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