One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.
Two Component, Addition Cured Silicone for bonding, sealing, and encapsulating. Featuring optical clarity and excellent strength properties.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.
One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. Meets ISO 10993-5
One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. May be utilized for impregnation applications and spin coating.
Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation
Two Component, thermally conductive, electrically insulative epoxy system for medical device applications. ISO 10993-5 certified.
Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures and Sterilization Resistance, Passes 10993-5 for Cytotoxicity