Two Component, Silver Conductive Epoxy Adhesive for High Performance Bonding Featuring Rapid Set Up Time, Superior Bond Strength and Exceptionally Low Volume Resistivity Meets ISO 10993-5 for Cytotoxicity.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
Two Component, Flexible, Low Viscosity Epoxy Compound Meets ISO 10993-5 certification. Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Excellent Adhesion To Engineering Plastics And Metals, Polycarbonates And Acrylics
One component, heat cured epoxy system for bonding, sealing, dam-and-fill applications. Resists temperatures up to +600°F. Thermally conductive, electrically insulating.
