One Component Epoxy

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 cures within 2-3 hours at 175-185°F [80-85°C], which is advantageous for use on heat sensitive components and substrates.

Supreme 3CCM-85 is a toughened adhesive system, that bonds well to a variety of similar and dissimilar substrates. It has a high volume resistivity of more than 10¹⁴ ohm-cm and a thermal conductivity of 5-10 BTU•in/ft²•hr•°F [0.72-1.44 W/(m•K)]. The system is serviceable from -100°F to +350°F [-73°C to +177°C].

Since Supreme 3CCM-85 is not premixed and frozen and has a very long open time at room temperature, it is more convenient to handle and store than typical two component glob top systems. This opaque black compound has a thixotropic paste-like consistency and is easy to apply either manually or with an automated dispenser. Master Bond Supreme 3CCM-85 is available for use in common size syringes ranging from 10 cc to 30 cc as well as in standard size containers.

Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. “This thermally stable formulation has a high glass transition temperature of 410°F (210°C) and retains its bond strength at elevated temperatures,” says Rohit Ramnath, senior product engineer. “As a toughened system, it is ideal for bonding dissimilar substrates. Supreme 17HT’s unique combination of properties makes it suitable for applications involving repeated exposure to thermal cycling.” It also meets NASA low outgassing specifications per ASTM E595 testing.

Supreme 17HT possesses high bond strength properties with lap shear strength of 1,900-2,100 psi and tensile strength of 7,000-8,000 psi. This system is a reliable electrical insulator with volume resistivity of over 10¹⁵ ohm-cm at ambient temperatures and over 10¹² ohm-cm at 400°F. It is serviceable from -100°F to +550°F (-73°C to 288°C). Along with its simple handling properties, Supreme 17HT offers a moderate viscosity of 100,000-150,000 cps.

Supreme 17HT cures at elevated temperatures with cure schedule options including 300°F for 5-6 hours or 350°F for 4-5 hours. It is available in standard packaging ranging from ½ pint to 5 gallon containers as well as specialty packaging including cartridges and syringes.

Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications. EP17HTND-CCM meets NASA low outgassing specifications and is serviceable from -80°F to +600°F [-62°C to +316°C]. This adhesive forms high strength bonds to a wide variety of similar/dissimilar substrates such as metals, ceramics, plastics, composites and various circuit board materials.

EP17HTND-CCM is thermally conductive and electrically non-conductive even upon exposure to hostile environmental conditions. EP17HTND-CCM has a high volume resistivity of more than 10¹⁵ ohm-cm at 75°F and over 10¹² ohm-cm at 400°F. Its thermal conductivity is 9-10 BTU•in/ft²•hr•°F [1.4423 W/(m•K)] at 75°F. Also noteworthy is its ability to resist many chemicals including acids, bases, salts, fuels, oils and many solvents.

Formulated for various electronic applications, EP17HTND-CCM cures readily in 1-2 hours at 350°F [175°C] with a relatively low exotherm upon curing. It can be dispensed from a syringe, either manually or with an automatic dispenser. Master Bond EP17HTND-CCM is available for use in common size syringes ranging from 10 cc to 30 cc. For storage simple refrigeration at 40-45°F is recommended.