One Component Epoxy

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a variety of applications where electrical conductivity is required: bonding, sealing, coating, as well as gap filling and encapsulating.

EP4S-80 features excellent mechanical properties with a tensile modulus of 500,000-600,000 psi and a compressive strength of 22,000-24,000 psi at 25°C. This electrically conductive system offers a volume resistivity of 0.02-0.06 ohm-cm and a thermal conductivity of 1.30-1.44 W/(m•K). Upon curing, EP4S-80 offers low shrinkage, excellent dimensional stability and a glass transition temperature of 130-135°C. Serviceable over the temperature range of -60°C to +150°C [-75°F to +300°F], this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics. It is packaged in ounce and pound jars.

Master Bond EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. This graphite filled compound is not premixed and frozen and has an unlimited working life at room temperature. It offers electrical conductivity with a volume resistivity of 5-15 ohm-cm and a thermal conductivity of 2.88-3.46 W/(m•K) at room temperature.

“EP5G-80 is a specialty non-metallic system designed for heat sensitive electronic applications where high levels of conductivity are desired. Its key feature is that it does not need elevated heat to fully cure,” says Rohit Ramnath, Senior Product Engineer. “Unlike other graphite filled adhesives, EP5G-80 is a smooth thixotropic paste and can be easily dispensed manually or using automated systems.”

For a conductive system, EP5G-80 provides an especially high Tg of around 130°-140°C, and a tensile modulus that exceeds 1,000,000 psi at room temperature. It is serviceable over the temperature range of -50°C to +175°C and has a low coefficient of thermal expansion. Suitable for bonding, sealing and coating, EP5G-80 adheres well to a variety of substrates such as metals, composites, ceramics and many plastics. This formulation features a good lubricity and can be employed for static dissipation and EMI/RFI shielding applications. It is black in color and RoHS compliant. Packaging is available in syringes, jar and pint containers.