Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermal Conductivity, Excellent Electrical Insulation Properties and Exceptionally Long Working Life.
One Component Epoxy System for Bonding, Sealing, Coating and Casting. Notable Retention of Properties at High Temperatures, Serviceable Up to 600°F. Qualifies to NASA ASTM E595 for low outgassing.