Two Component, Heat Resistant, Epoxy System for High Performance Bonding, Sealing and Casting. Features a Glass Transition Temperature in Excess of 220°C; Requires Elevated Temperature Curing at 250°F or Above.
Two Component, Heat Resistant, Epoxy System for High Performance Bonding, Sealing and Casting. Features a Glass Transition Temperature in Excess of 220°C; Requires Elevated Temperature Curing at 250°F or Above.
One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.
