Two Component, Thermally Conductive, Electrically Insulating Epoxy for High Performance Bonding, Sealing and Encapsulation. Features a Glass Transition Temperature in Excess of 200°C; Requires Elevated Temperature Curing at 250°F or Above. Meets NASA Low Outgassing.
Two Component Heat Resistant Epoxy System for High Performance Structural Bonding and Casting Featuring a Glass Transition Temperature in Excess of 220°C Suitable for Repeated Autoclaving, Radiation and Chemical Sterilants Meets USP Class VI Requirements
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a Convenient 1:1 Mix Ratio and Fast Cure
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a Convenient One To One Mix Ratio and Fast Cure.
Two Component, Room Temperature Curing Epoxy Adhesive Featuring Superior and Cost Effective Bonding Performance with Exceptionally Fast Cures for Service from 4K to 400°F.
Two Component High Performance Epoxy System for Bonding and Sealing, Ultra Fast Setting, 3 Minute Type Curing System Featuring Cryogenic Serviceability.
