EP51ND Product Information

EP51ND Two Part Epoxy

Two Component Epoxy Adhesive For Fast "5 Minute" Cure, High Performance General Purpose Bonding and Sealing

EP62-1 Product Information

EP62-1 Two Part Epoxy System

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures Chemical and High Temperature Resistance

EP62-1Med Product Information

EP62-1Med Two Component Epoxy System

Two Component Epoxy Resin System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures at Moderately Elevated Temperatures and Chemical and High Temperature Resistance.

Meets USP Class VI Requirements.

EP65 Product Description

EP65 Two Component Epoxy

Two Component Fast Curing Epoxy Adhesive Featuring High Shear Strength, Superior Dimensional Stability and Good Chemical Resistance for Superior Bonding

EP65HT Product Information

EP65HT Two Component Epoxy

Two Component Epoxy System Featuring the Unique Combination of Very Fast Setting and Curing Along with High Temperature Resistance.

EP65HT-1 Product Information

EP65HT-1 Two Part Epoxy

Two Component Epoxy System Featuring the Unique Combination of Ultra Fast Setting and Curing Along with High Temperature Resistance. Meets NASA Low Outgassing Specifications.

EP75-1 Product Information

EP75-1 Two Part Epoxy System

Two component, graphite conductive epoxy system for bonding, sealing, coating

EP76M Product Information

 EP76M Two Part Epoxy

Two Component Nickel Conductive Epoxy System for Bonding, Sealing and Coating Featuring Convenient Handling and Good Electrical Conductivity.

EP76M-1R Product Information

Two Component Nickel Conductive Epoxy

Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity

EP77M-1 Product Information

EP77M-1 Two Part Epoxy

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Room Temperature Cure and Exceptionally Low Volume Resistivity.

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