Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels, Along with High Temperature Resistance.
Two Component Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating. Including Small Encapsulations, Pottings & Castings Featuring Fast Set-Up and Handling Time Meets USP Class VI and ISO 10993-5 Specifications for Medical Applications.
Two Component, Low Viscosity Room Temperature Curable, Epoxy Adhesive, Sealant, Coating & Casting System Featuring Both Outstanding Chemical and Heat Resistance.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System Featuring Outstanding Heat, Chemical and Steam Resistance.
Two Component, Thermally Conductive Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications.
Two Component, Thermally Conductive, Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications. Passes NASA low outgassing. Cryogenically Serviceable.
Two Component, Room Temperature Setting, Heat Resistant Epoxy System for Bonding, Sealing, Coating & Casting Specially Formulated for Food Applications.
Two Component, Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System Featuring Resistance to Sterilization Including Radiation, Chemicals and Steam.
Two Component, Room Temperature Curable, Epoxy Adhesive, Sealant, Coating and Casting System Featuring High Temperature Resistance. Meets NASA Low Outgassing Specifications.
