Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
One Component, Thermally Conductive, Electrically Isolating, Room Temperature Curing, Non-Corrosive Silicone for High Performance Bonding, Sealing & Coating
One Component, Room Temperature Curing, Silicone Elastomer Adhesive For High Performance Bonding and Sealing; Featuring Ultra Fast and Non-Corrosive Cure.
