EP21TPFL-1AO Product Information

EP21TPFL-1AO Two Part Epoxy Polysuifide System

Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System for High Performance Bonding, Sealing, Coating and Casting; Outstanding Resistance to Fuels and Oils with Superior Thermal Conductivity and Electrical Insulation Properties.

EP30AN Product Information

EP30AN Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.

EP30FL Product Information

EP30FL Two Part Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Potting, Casting, Bonding and Sealing Featuring Exceptionally Low Viscosity and Good Flexibility.

EP30FLAO Product Description

EP30FLAO Two Part Epoxy Compound

Two Component, Room Temperature Curing, Flexibilized, Thermally Conductive, Electrically Isolating Epoxy for Potting, Bonding, Sealing and Coating. Featuring Low Viscosity and Cryogenic Service Capability.

EP30FLSP Product Description

EP30FLSP Two Component Epoxy

Low Viscosity, Flexibilized, Two Component Epoxy Compound for High Performance Potting, Casting, Encapsulation, Bonding and Sealing. Contains UV Blocking Agent & Wetting Agent

EP34AN Product Description

EP34AN Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Exceptionally High Thermal Conductivity.

EP34AO Product Description

EP34AO Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Excellent Thermal Conductivity.

EP35 Product Information

EP35 Two Part Epoxy

Two Component, Room Temperature Curing Epoxy Adhesive For High Temperature Bonding Applications

EP35TDC Product Description

EP35TDC Two Part Epoxy

Two Component, High Viscosity, Room Temperature Curing Epoxy Adhesive For High Temperature Bond Applications

EP36AN Product Information

EP36AN One Component, B-stage Epoxy

One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Very High Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.

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