Thermal Cycling Resistant

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

Biocompatible. Pass USP Class VI and ISO cytotoxicity testing. Non-corrosive, neutral type curing system. Good sterilization resistance properties. Withstand rigorous thermal cycling. Elongation 250-350%. Volume resistivit >1015 ohm-cm. Tensile strength 700-1100psi.

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulating Featuring a Convenient and Forgiving 1:1 Mix Ratio.