Two Component, Low Viscosity, Silicone Compound for High Performance Casting, Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Outstanding Flexibility and Unsurpassed Thermal Conductivity.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Encapsulation Featuring Very Low Exotherm and a Long Working Life.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
