Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermally Conductivity and Excellent Electrical Insulation Properties. Now NASA Approved for Low Outgassing Applications
Two Component, Room Temperature Curing Epoxy for Bonding, Sealing, Coating & Encapsulation with Exceptional Thermal Conductivity, Electrical Isolation and High Temperature Resistance.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Potting, Bonding, Sealing & Coating. Features Low Viscosity & Excellent Thermal Transfer Properties.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Bonding, Potting, Sealing & Coating. Offers High Temperature Resistance & Excellent Thermal Properties along with Good Flow.
Two Component, Nickel Modified Room Temperature Curing Polymer System Featuring High Electrical Conductivity, Superior Bonding Strength and Chemical Resistance For EMI/RFI Shielding As Well As Bonding, Sealing and Encapsulation Applications.
Two Component, Room Temperature Curing, Flexibilized, Thermally Conductive, Electrically Isolating Epoxy for Potting, Bonding, Sealing and Coating. Featuring Low Viscosity and Cryogenic Service Capability.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion, Excellent Dimensional Stability and Low Shrinkage Upon Cure.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.
